Author

Dan Feng

Texas A&M University - Cited by 38 - Design Manuf. & Metrol. - Vib. & Solid Mech. - R2R Flex. Electron. - 5G/6G Commun. Devices - Biol. Diagn. Platforms

Biography

Dr. Dan Feng is an Associate professor in the department of R2R Flexible Electronics Vibrations Post-Doctoral Research Associate, Purdue University United States. His study interests major on R2R Flexible Electronics Vibrations. Currently , Dr. Dan Feng is the author/editors/reviewer in several international journals. He published 5 articles in many journals and the articles are informative and got good citations.
Title
Cited by
Year
Bioinspired Manufacturing of Aerogels with Precisely Manipulated Surface Microstructure through Controlled Local Temperature Gradients
H Tetik, D Feng, SW Oxandale, G Yang, K Zhao, K Feist, N Shah, Y Liao, ...ACS Applied Materials & Interfaces 13 (1), 924-931, 2021202
12
2021
High-fidelity camera-based method for noncontact vibration testing of structures
PF Pai, D Feng, Y Duan54th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials …, 2013201
10
2013
Measuring nonuniform web tension for roll-to-roll manufacturing of flexible and printed electronics
D Feng, RB Wagner, A RamanFlexible and Printed Electronics 6 (3), 035006, 2021202
8
2021
Thermomechanics of axially moving webs in roll-to-roll manufacturing processes
D Feng, A RamanInternational Journal of Heat and Mass Transfer 129, 1317-1327, 2019201
6
2019
Vibrations of air-coupled web systems
D Feng, J Wang, GTC Chiu, A RamanJournal of Vibration and Acoustics 143 (1), 010
2
2021