Author

Md. Arafat Kabir

University of Arkansas - Cited by 30 - Computer Architecture - Parallel Computing - VLSI - EDA

Biography

Md. Arafat Kabir Department of Reconstructive Surgery for Oral and Maxillofacial Region, School of Dentistry, Health Sciences University of Hokkaido, Hokkaido, Japan. He published articles in a wide range of fields on like Endodontics, Orthodontics, Dental Implants, Prosthodontics, Restorative Dentistry, Oral and Maxillofacial Surgery, Periodontics, Forensic Dentistry, Digital Dentistry, Minimal Intervention Dentistry etc
Title
Cited by
Year
Chiplet-package co-design for 2.5 D systems using standard ASIC CAD tools
MDA Kabir, Y Peng2020 25th Asia and South Pacific Design Automation Conference (ASP-DAC), 351-356, 2020202
14
2020
Coupling extraction and optimization for heterogeneous 2.5 D chiplet-package co-design
MDA Kabir, D Petranovic, Y PengProceedings of the 39th International Conference on Computer-Aided Design, 1-8, 2020202
6
2020
Holistic Chiplet–Package Co-Optimization for Agile Custom 2.5-D Design
MDA Kabir, Y PengIEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021202
4
2021
Brain-drive: A smart driver for controlling digital appliances using cognitive command
RI Chowdhury, AK Sun, A Tamir, C Shahnaz, SA Fattah2017 IEEE Region 10 Humanitarian Technology Conference (R10-HTC), 851-855, 2017201
3
2017
Holistic and In-Context Design Flow for 2.5 D Chiplet-Package Interaction Co-Optimization
Holistic and In-Context Design Flow for .5 D Chiplet-Package Interaction Co-OptimizationMDA Kabir, W Hung, TY Ho, Y Peng01 International Symposium on VLSI Design, Automation and Test (VLSI-DAT), 1-4, 010
2
2021
A Scalable In-Context Design and Extraction Flow for Heterogeneous 2.5 D Chiplet-Package Co-Optimization
MDA Kabir, D Petranovic, Y Peng202 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 20220
1
2021

Referred From: https://scholar.google.com/citations?hl=en&user=-GtU-QMAAAAJ

Cited by
Citations 30
h-index 3
i10-index 1
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